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340 days ago
Unfiled. Edited by AMBER , Toby 340 days ago
AMBER 分析流程
1.確認複製狀況,若可以快速複製goto 3 , else goto 2
2.想方式進行快速複製問題,單一pattern stress或是加強環溫或是降低電壓
Toby 3.確認fail or hang住當下,RDT FW執行的測項
4. 檢查當下RDT FW行為,並檢查interrupt相關資訊,分析fail機率較高的IP,並與HW 窗口(E13 JP/E12 San/E19 Van)討論.
5. 嘗試調整core power、溫度、迴圈次數或SRAM操作範圍等常見變因,看fail狀況是否有影響
6. 將RDT FW行為、interrupt、對應IP register相關資訊提供給對應HW
7. 與HW討論狀況,確認進一步實驗方向,by HW IP設計不同實驗,調整RDT code或其他變因,細追fail root cause
8. 根據fail root cause討論是否需要新增error code、新增RDT test pattern細分error原因
9. 討論現行FT流程可否卡下、是否需要將pattern導入FT test or FT RDT

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